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Semiconductor News

발행 2026년 7월 29일

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2026-07-26 ~ 2026-07-29 · 반도체 주요 소식 50건. 제목을 누르면 원문으로 이동합니다.

날짜출처키워드제목

2026-07-29🇺🇸 SemiWiki전문지Interview with Simon Davidmann, AI + EDA Researcher and Former CEO of Imperas
2026-07-29🇺🇸 IEEE Spectrum전문지Laboratoria’s Mariana Costa Empowers Women in Tech
2026-07-29🇺🇸 EE Times전문지Microchip Acquires Edge AI Chip Startup Hailo
2026-07-29🇺🇸 SemiWiki전문지Quadric Extends Series C to $46 Million as Edge AI Demand Accelerates
2026-07-29🇺🇸 Tom's HardwarechipMystery reviewer 'finds' Nvidia RTX Spark prototype laptop and puts it through its paces — Microsoft Surface Laptop Ultra with Nvidia N1X chip shows promise, though prototype warts are still quite visible
2026-07-29🇰🇷 조선비즈반도체中반도체 일어서자, 코스피 주저앉았다
2026-07-28🇺🇸 EE Times전문지How to Build a 100Gbps Server-Grade AOI Platform for Next-Generation Semiconductor Inspection
2026-07-28🇺🇸 EE Times전문지Vibe Coding in Safety-Critical Software: Promise, Pitfalls, and a Path Forward
2026-07-28🇺🇸 SemiWiki전문지Security by Design: Arteris Expands Its Partnership with Arm
2026-07-28🇺🇸 IEEE Spectrum전문지Why NIST Researchers Spent 10 Years Measuring Gravity
2026-07-28🇰🇷 매일경제 IT/전자반도체“中 CXMT 상장보다 ‘이것’ 개발이 더 큰 충격”…반도체주 흔든 주범, 따로 있었다
2026-07-28🇺🇸 Tom's HardwarechipNvidia employee detained in Taiwan as part of chip smuggling probe — held on suspicion of falsifying business documents, company says smuggling 'a nonstarter'
2026-07-28EE News Europe전문지CRA-ready IoT products webinar from eeNews and Lemberg
2026-07-28EE News Europe전문지IBM acquires HRL to expand quantum roadmap
2026-07-28EE News Europe전문지VDC finds memory-safe languages cut software costs
2026-07-28🇺🇸 EE Times전문지Will Purging Chinese Tech Cost Europe Its Digital Future?
2026-07-28EE News Europe전문지Siemens advances self-verifying AI for EDA
2026-07-28🇺🇸 Electronics WeeklychipNvidia says agentic AI is reshaping chip system design
2026-07-28🌐 EE Times Asia전문지Synopsys, Intel Foundry Expand AI-powered EDA Collaboration for Intel 14A
2026-07-28🌐 EE Times Asia전문지TrendForce: NVIDIA and Broadcom Begin Volume Ramp of CPO Switches
2026-07-28🌐 EE Times Asia전문지DigiKey, Arduino Launch Dream Lab Challenge with $20,000 in Prizes
2026-07-28🌐 EE Times Asia전문지Power Electronics Market Entering New Growth Phase
2026-07-28🇺🇸 SemiWiki전문지How early symmetry validation eliminates costly late-stage respins
2026-07-28🇺🇸 Fabricated Knowledge전문지Close but Not Quite
2026-07-28🇺🇸 Chips and Cheese전문지AMD Advancing AI 2026: Talking CDNA5 with AMD’s Alan Smith
2026-07-28🇺🇸 Applied MaterialsDRAM2026 DRAM and Advanced Packaging Master Class
2026-07-28🇺🇸 IEEE Spectrum전문지Why AI-Driven Cognitive Systems Are Redefining Radar and Electronic Warfare
2026-07-28EE News Europe전문지System Check: What do you spend on electronics?
2026-07-28🇺🇸 SemiWiki전문지Rethinking Formal Verification in the AI Era
2026-07-28🇺🇸 EE Times전문지Warning Shots Fired as AMD Announces New Data Center GPUs
2026-07-28🇺🇸 Tom's HardwarelithographyChina begins mass production of homegrown immersion chipmaking machines in major breakthrough, report claims — first DUV lithography units will be delivered this year to SMIC, Hua Hong, and CXMT
2026-07-28🇺🇸 EE Times전문지Automotive Ethernet and Time Sensitive Networking (TSN) for Next Generation Vehicles
2026-07-28🇺🇸 Tom's HardwarechipIntel unveiled its iconic Core 2 Duo family 20 years ago — legendary chip dethroned AMD Athlon, restoring the chipmaker’s performance lead
2026-07-27🇺🇸 EE Times전문지Bringing Inference to the Patient: Systems Architecture for Healthcare Edge AI
2026-07-27🇺🇸 EE Times전문지Adaptive Hardware Could Change How EV Chargers Are Designed
2026-07-27🇺🇸 Tom's HardwareHBMChinese memory maker CXMT posts blistering 466% leap in Shanghai IPO — bulk of spending to be focused on DRAM production, no HBM in sight
2026-07-27EE News Europe전문지AMD unveils rack-scale AI platform and embedded AI processors
2026-07-27EE News Europe전문지What now for the Arm Cortex-M microcontroller?
2026-07-27EE News Europe전문지NVIDIA expands Jetson Thor lineup with T3000 and T2000 edge AI modules
2026-07-27EE News Europe전문지AI Network Optimization Helped T-Mobile Manage Major Soccer Tournament
2026-07-27EE News Europe전문지Samsung and Broadcom deepen AI semiconductor partnership with $200bn collaboration
2026-07-27🇺🇸 EE Times전문지CXMT IPO: Where China’s Largest DRAM Maker Stands?
2026-07-27🌐 EE Times Asia전문지Global PC Shipments Down for First Time Since 1Q 2025 Amid Memory Crunch
2026-07-27🌐 EE Times Asia전문지Advantech Launches AMD EPYC 9006-powered Servers for AI, Edge Infrastructure
2026-07-27🌐 EE Times Asia전문지Synopsys, NVIDIA Advance Autonomous AI Agents for Chip Design and Engineering
2026-07-27🌐 EE Times Asia전문지AI Infrastructure Shifts Data Centers into Chip Industry’s Next Strategic Battleground
2026-07-27🌐 AsianometryDRAMTrue 3D DRAM
2026-07-26🇺🇸 Tom's HardwareDRAMChinese CXMT DRAM doesn't look like the budget savior many were expecting — new modules enter the market, but prices still track the big three
2026-07-26🇺🇸 Tom's Hardwarechip3D-printed F-14 Tomcat uses an FPGA recreation of the ‘world’s first microprocessor' — CADC’s MP944 chip controls the fighter’s swing-wing system, among other things
2026-07-26🇺🇸 Tom's HardwareEUVZeiss expands German site that caps ASML's EUV scanner output — first new building opens four years after Oberkochen site groundbreaking