半导体
Semiconductor News
发布 2026年7月14日
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2026-07-13 ~ 2026-07-14 · 半导体 主要资讯 37 条。点击标题前往原文。
日期来源关键词标题
- 2026-07-14🇺🇸 Tom's HardwarefoundryTesla's AI5 with 2nm-class node tapes out at Samsung Foundry — production starts soon, months after TSMC tape out
- 2026-07-14🇺🇸 EE Times专业媒体Rochester Electronics and Qorvo® Team to Offer Long-Term Availability of RF Components
- 2026-07-14🇺🇸 EE Times专业媒体Interview with GlobalFoundries VP at MIPS ‘Physical AI is Agentic AI at the Edge’ Taipei Event
- 2026-07-13EE News Europe专业媒体SiPearl CEO Philippe Notton on Europe’s AI processors, chiplets, and semiconductor sovereignty
- 2026-07-13🌐 EE Times Asia专业媒体Rigaku Strengthens Global Semiconductor Metrology Service Support with New Osaka Training Center
- 2026-07-13🌐 EE Times Asia专业媒体Apple Expands Broadcom Partnership with $30B Commitment for US-made Wireless Chips
- 2026-07-13🌐 EE Times Asia专业媒体Longsys Reaches 1M Monthly mSSD Output to Support Expanding Edge AI Storage Demand
- 2026-07-13🌐 EE Times Asia专业媒体RISC-V Gains Ground as Preferred Computing Architecture for Space Missions
- 2026-07-13🇺🇸 SemiWiki专业媒体Executive Interview with Ebrahim Hussain and Aaditya Subediand of Architect Labs