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Semiconductor News · News · Dapanda

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半导体

Semiconductor News

发布 2026年7月16日

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2026-07-15 ~ 2026-07-16 · 半导体主要资讯 33 条。点击标题前往原文。

日期来源关键词标题

2026-07-16🇺🇸 EE Times专业媒体How Nidec Is Rethinking Gear Design for Humanoid and Mobile Robots
2026-07-16🇺🇸 SemiWiki专业媒体DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!
2026-07-16🇰🇷 조선비즈

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반도체

삼전닉스 당분간 걱정없다? 올해 세계 반도체 매출 사상 최초 1조달러 예상

2026-07-16🇺🇸 IEEE Spectrum专业媒体When Career Risks Are Worth Taking

2026-07-16🇺🇸 EE Times专业媒体TYLsemi De-Risks Chiplets With New Business Model

2026-07-16🇺🇸 IEEE Spectrum专业媒体Notice to Membership

2026-07-16🇺🇸 SemiWiki专业媒体Perforce Enabling Innovation Without Introducing Risk at DAC 2026

2026-07-16🇺🇸 IEEE Spectrum专业媒体The First Chatbot’s Multiple Personalities

2026-07-16🇺🇸 Tom's HardwareEUVIntel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV — select Panther Lake layers on 18A are now dual-qualified for 0.55 NA scanners

2026-07-16🇰🇷 조선비즈반도체반도체주 일제히 급등… 상승세 이어질까

2026-07-16🇰🇷 조선비즈반도체엔비디아가 찜한 韓 반도체 스타트업… LB인베스트먼트도 1000만달러 투자

2026-07-15🇺🇸 Tom's HardwarechipIntel's EMIB packaging gains traction as chip designers look to skirt TSMC's CoWoS constraints — Google's reported decision for 9th-gen TPUs highlights Intel's attractive alternative

2026-07-15🇺🇸 SemiWiki专业媒体Arteris at DAC 2026 Connecting Innovation for Silicon Success

2026-07-15🇺🇸 EE Times专业媒体Why TL3228 Is the Go-To Standard Chip Powering True 8K Wireless Gaming Peripherals

2026-07-15🇺🇸 EE Times专业媒体Massive Stock, Full-Chain Service — Your Global Semiconductor Partner

2026-07-15🇺🇸 EE Times专业媒体After Magdeburg, Intel Builds on Ireland’s Existing Strength

2026-07-15EE News Europe专业媒体Arm expands Arteris security tools across CPU designs

2026-07-15🇺🇸 Tom's HardwareDRAMCXMT close to matching Micron's memory capacity in 2026, research claims — would put China on track to become world's second-largest DRAM producer

2026-07-15EE News Europe专业媒体Distribution and supply chain under pressure: how the channel is rewriting the rules

2026-07-15EE News Europe专业媒体Fourth-generation ultrasonic frontend brings an architectural shift to high-precision smart metering

2026-07-15🇰🇷 매일경제 IT/전자반도체AI혁신·포스트반도체 … 부처별 특색사업 지원

2026-07-15EE News Europe专业媒体Qorvo signs lifecycle deal for RF components

2026-07-15EE News Europe专业媒体NVIDIA Ising decoder cuts quantum error rates 347x

2026-07-15🇺🇸 EE Times专业媒体Probabilistic Computing Is Already Here; Here Is How It Works

2026-07-15EE News Europe专业媒体ASML posts €9.3bn Q2 sales, raises 2026 outlook

2026-07-15🇰🇷 매일경제 IT/전자반도체“이러니 여기저기서 버블 걱정”…반도체 기업 자금 몰리며 통화량 32조 급증

2026-07-15🌐 EE Times Asia专业媒体Rohde & Schwarz Expands GCF Validation for 5G NR-NTN Conformance Testing

2026-07-15🌐 EE Times Asia专业媒体DEEPX Expands Physical AI Platform Through Global Developer Ecosystem Collaborations

2026-07-15🌐 EE Times Asia专业媒体SLC NAND Prices Projected to Increase by Up to 170% in 2H 2026

2026-07-15🇰🇷 매일경제 IT/전자반도체정부, 목포·군산항 해상풍력 지원 늘린다…호남반도체 전력공급 대비

2026-07-15🌐 EE Times Asia专业媒体Asahi Kasei Enhances Taiwan Facility Capabilities to Meet Growing Demand for Advanced Packaging

2026-07-15🌐 EE Times Asia专业媒体INFINITIX, SAINS Partner to Strengthen Malaysia’s Sovereign AI Infrastructure

2026-07-15🌐 EE Times Asia专业媒体Alif Semiconductor Bets on Edge AI Leadership with Next-gen AI MCUs