半导体

Semiconductor News

发布 2026年7月18日

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2026-07-17 ~ 2026-07-18 · 半导体主要资讯 25 条。点击标题前往原文。

日期来源关键词标题

2026-07-18🇰🇷 조선비즈半導体創新メモリーIPO秒読み半導体自立試す
2026-07-18🇰🇷 조선비즈半導体AIピーク論争で個人戦略二極化半導体揺れる
2026-07-18🇰🇷 조선비즈칩[인터뷰] 알란 라가스카 ST마이크로 디렉터 “휴머노이드, 스마트폰값 돼야 대중화… 칩 통합해 원가 낮춘다”
2026-07-18🇰🇷 조선비즈반도체호남 반도체 클러스터 계기로 원전 추진하는 정부… 부지 확보까지는 ‘첩첩산중’
2026-07-18🇰🇷 조선비즈반도체[비즈차이나] AI 호황 올라탄 中 창신메모리… 역대급 몸값으로 ‘반도체 굴기’ 시험
2026-07-18🇺🇸 EE Times专业媒体New Material Beats Copper’s Thermal Conductivity
2026-07-18🇺🇸 IEEE Spectrum专业媒体This Graduate Student Equips NASA’s Robots With Assembly Skills
2026-07-18🇺🇸 SemiWiki专业媒体CEO Interview with Madhulima Tewari of VerifAIX
2026-07-18🇺🇸 Tom's HardwarelithographyASML's planned Low-NA EUV machine price hikes reportedly frustrate TSMC — lithography machine maker comes knocking to make bank on TSMC's profitable fabs, potentially costing the Taiwanese chipmaker billions
2026-07-18🇺🇸 Tom's HardwareTSMCTSMC confirms significant yield and performance improvements in A14 update — strong interest from AI/HPC and smartphone customers
2026-07-18🇺🇸 SemiWiki专业媒体TSMC CoWoS versus Intel EMIB Semiconductor Packaging
2026-07-17🇰🇷 조선비즈半導体NY株下落半導体売りと米イラン衝突響く
2026-07-17🇰🇷 조선비즈반도체뉴욕증시, 반도체株 매도세에 하락 출발… 美·이란 무력 충돌도 영향
2026-07-17🇺🇸 EE Times专业媒体ASML Raises Outlook, Plans More EUV Capacity
2026-07-17🇺🇸 EmbeddedpackagingVector Photonics Develops New PCSEL Packaging Technology
2026-07-17🇺🇸 SemiWiki专业媒体TSMC’s Raises the Bar on CAPEX!
2026-07-17🇺🇸 Tom's HardwarewaferASML looks to increase prices of its Low-NA EUV tools beyond existing productivity-based model — company wants to capture the value of all the advantages its tools offer, not just wafer throughput improvements
2026-07-17EE News Europe专业媒体Europe unveils electrification plan to drive competitiveness
2026-07-17🇺🇸 Electronics WeeklychipMost Read – Intel Leixlip, Tesla A15 chip, MicroLED manufacturing
2026-07-17🌐 EE Times Asia专业媒体esmo Expands Global Operations as It Marks 25 Years in Service
2026-07-17EE News Europe专业媒体Adtran expands rural fiber network in Illinois
2026-07-17🌐 EE Times Asia专业媒体Hanyang University Develops Solvent-based Method for Controlled Organic Semiconductor Doping
2026-07-17🇺🇸 EE Times专业媒体TSMC Boosts 2026 Expansion Budget, Adds $100B to U.S. Investment
2026-07-17🌐 EE Times Asia专业媒体TetraMem, SK hynix Highlight Memristor-Based AI Computing SoC Collaboration
2026-07-17🌐 EE Times Asia专业媒体SEMI Forecasts Global Chip Equipment Sales to Reach Record $229B in 2028