半导体

Semiconductor News

发布 2026年7月29日

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2026-07-26 ~ 2026-07-29 · 半导体主要资讯 50 条。点击标题前往原文。

日期来源关键词标题

2026-07-29🇺🇸 SemiWiki专业媒体Interview with Simon Davidmann, AI + EDA Researcher and Former CEO of Imperas
2026-07-29🇺🇸 IEEE Spectrum专业媒体Laboratoria’s Mariana Costa Empowers Women in Tech
2026-07-29🇺🇸 EE Times专业媒体

Microchip Acquires Edge AI Chip Startup Hailo

2026-07-29🇺🇸 SemiWiki专业媒体Quadric Extends Series C to $46 Million as Edge AI Demand Accelerates

2026-07-29🇺🇸 Tom's HardwarechipMystery reviewer 'finds' Nvidia RTX Spark prototype laptop and puts it through its paces — Microsoft Surface Laptop Ultra with Nvidia N1X chip shows promise, though prototype warts are still quite visible

2026-07-29🇰🇷 조선비즈반도체中반도체 일어서자, 코스피 주저앉았다

2026-07-28🇺🇸 EE Times专业媒体How to Build a 100Gbps Server-Grade AOI Platform for Next-Generation Semiconductor Inspection

2026-07-28🇺🇸 EE Times专业媒体Vibe Coding in Safety-Critical Software: Promise, Pitfalls, and a Path Forward

2026-07-28🇺🇸 SemiWiki专业媒体Security by Design: Arteris Expands Its Partnership with Arm

2026-07-28🇺🇸 IEEE Spectrum专业媒体Why NIST Researchers Spent 10 Years Measuring Gravity

2026-07-28🇰🇷 매일경제 IT/전자반도체“中 CXMT 상장보다 ‘이것’ 개발이 더 큰 충격”…반도체주 흔든 주범, 따로 있었다

2026-07-28🇺🇸 Tom's HardwarechipNvidia employee detained in Taiwan as part of chip smuggling probe — held on suspicion of falsifying business documents, company says smuggling 'a nonstarter'

2026-07-28EE News Europe专业媒体CRA-ready IoT products webinar from eeNews and Lemberg

2026-07-28EE News Europe专业媒体IBM acquires HRL to expand quantum roadmap

2026-07-28EE News Europe专业媒体VDC finds memory-safe languages cut software costs

2026-07-28🇺🇸 EE Times专业媒体Will Purging Chinese Tech Cost Europe Its Digital Future?

2026-07-28EE News Europe专业媒体Siemens advances self-verifying AI for EDA

2026-07-28🇺🇸 Electronics WeeklychipNvidia says agentic AI is reshaping chip system design

2026-07-28🌐 EE Times Asia专业媒体Synopsys, Intel Foundry Expand AI-powered EDA Collaboration for Intel 14A

2026-07-28🌐 EE Times Asia专业媒体TrendForce: NVIDIA and Broadcom Begin Volume Ramp of CPO Switches

2026-07-28🌐 EE Times Asia专业媒体DigiKey, Arduino Launch Dream Lab Challenge with $20,000 in Prizes

2026-07-28🌐 EE Times Asia专业媒体Power Electronics Market Entering New Growth Phase

2026-07-28🇺🇸 SemiWiki专业媒体How early symmetry validation eliminates costly late-stage respins

2026-07-28🇺🇸 Fabricated Knowledge专业媒体Close but Not Quite

2026-07-28🇺🇸 Chips and Cheese专业媒体AMD Advancing AI 2026: Talking CDNA5 with AMD’s Alan Smith

2026-07-28🇺🇸 Applied MaterialsDRAM2026 DRAM and Advanced Packaging Master Class

2026-07-28🇺🇸 IEEE Spectrum专业媒体Why AI-Driven Cognitive Systems Are Redefining Radar and Electronic Warfare

2026-07-28EE News Europe专业媒体System Check: What do you spend on electronics?

2026-07-28🇺🇸 SemiWiki专业媒体Rethinking Formal Verification in the AI Era

2026-07-28🇺🇸 EE Times专业媒体Warning Shots Fired as AMD Announces New Data Center GPUs

2026-07-28🇺🇸 Tom's HardwarelithographyChina begins mass production of homegrown immersion chipmaking machines in major breakthrough, report claims — first DUV lithography units will be delivered this year to SMIC, Hua Hong, and CXMT

2026-07-28🇺🇸 EE Times专业媒体Automotive Ethernet and Time Sensitive Networking (TSN) for Next Generation Vehicles

2026-07-28🇺🇸 Tom's HardwarechipIntel unveiled its iconic Core 2 Duo family 20 years ago — legendary chip dethroned AMD Athlon, restoring the chipmaker’s performance lead

2026-07-27🇺🇸 EE Times专业媒体Bringing Inference to the Patient: Systems Architecture for Healthcare Edge AI

2026-07-27🇺🇸 EE Times专业媒体Adaptive Hardware Could Change How EV Chargers Are Designed

2026-07-27🇺🇸 Tom's HardwareHBMChinese memory maker CXMT posts blistering 466% leap in Shanghai IPO — bulk of spending to be focused on DRAM production, no HBM in sight

2026-07-27EE News Europe专业媒体AMD unveils rack-scale AI platform and embedded AI processors

2026-07-27EE News Europe专业媒体What now for the Arm Cortex-M microcontroller?

2026-07-27EE News Europe专业媒体NVIDIA expands Jetson Thor lineup with T3000 and T2000 edge AI modules

2026-07-27EE News Europe专业媒体AI Network Optimization Helped T-Mobile Manage Major Soccer Tournament

2026-07-27EE News Europe专业媒体Samsung and Broadcom deepen AI semiconductor partnership with $200bn collaboration

2026-07-27🇺🇸 EE Times专业媒体CXMT IPO: Where China’s Largest DRAM Maker Stands?

2026-07-27🌐 EE Times Asia专业媒体Global PC Shipments Down for First Time Since 1Q 2025 Amid Memory Crunch

2026-07-27🌐 EE Times Asia专业媒体Advantech Launches AMD EPYC 9006-powered Servers for AI, Edge Infrastructure

2026-07-27🌐 EE Times Asia专业媒体Synopsys, NVIDIA Advance Autonomous AI Agents for Chip Design and Engineering

2026-07-27🌐 EE Times Asia专业媒体AI Infrastructure Shifts Data Centers into Chip Industry’s Next Strategic Battleground

2026-07-27🌐 AsianometryDRAMTrue 3D DRAM

2026-07-26🇺🇸 Tom's HardwareDRAMChinese CXMT DRAM doesn't look like the budget savior many were expecting — new modules enter the market, but prices still track the big three

2026-07-26🇺🇸 Tom's Hardwarechip3D-printed F-14 Tomcat uses an FPGA recreation of the ‘world’s first microprocessor' — CADC’s MP944 chip controls the fighter’s swing-wing system, among other things

2026-07-26🇺🇸 Tom's HardwareEUVZeiss expands German site that caps ASML's EUV scanner output — first new building opens four years after Oberkochen site groundbreaking