半导体

Semiconductor News

发布 2026年9月1日

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2026-08-21 ~ 2026-09-01 · 半导体主要资讯 80 条。点击标题前往原文。

日期来源关键词标题

2026-09-01🇰🇷 조선비즈반도체[속보] 8월 수출 982.5억달러, 3개월 연속 900억대… 반도체 ‘역대 최대’ 호황
2026-09-01🌐 EE Times Asia专业媒体Microchip Shrinks PolarFire Ethernet Sensor Bridge for Edge AI Systems
2026-09-01🌐 EE Times Asia专业媒体Kioxia and Sandisk Plan $31B Japan Investment to Expand NAND Capacity
2026-09-01🌐 EE Times Asia专业媒体TrendForce Sees Start of MLCC Industry Upcycle
2026-09-01🌐 EE Times Asia专业媒体GigaDevice Inks Partnership with Rutronik to Strengthen Presence in EMEA and Southeast Asia
2026-09-01🇺🇸 SemiWiki专业媒体Intel’s 14A Is Winning the Race Against Defects
2026-09-01🇺🇸 IEEE Spectrum专业媒体This Teen Helped Native American Students Earn Ham Radio Licenses
2026-09-01🇺🇸 SemiWiki专业媒体GenAlpha Brings a Practical Approach for Analog AI to DAC 2026
2026-09-01🇺🇸 EE Times专业媒体SUSE Positions Hardware Choice as a Core Part of Sovereign AI
2026-08-31🇰🇷 디일렉 반도체칩'TSMC 단골' LG전자…코아시아세미와 협력해 삼성 파운드리서 칩 생산
2026-08-31🇺🇸 IEEE Spectrum专业媒体The EU’s AI Drive Undermines Its Own Chip Strategy
2026-08-31🇺🇸 EE Times专业媒体When Off-The-Shelf Isn’t Enough
2026-08-31EE News Europe专业媒体Optical MEMS microphone pushes dynamic range to 136 dB
2026-08-31🇺🇸 SemiWiki专业媒体Exploiting agentic automation cost-effectively. Innovation in Verification
2026-08-31EE News Europe专业媒体Radiation-hardened semiconductors fly on NASA Roman telescope
2026-08-31🇺🇸 IEEE Spectrum专业媒体The First Battery Was Inspired By a Dead Frog
2026-08-31🌐 EE Times Asia专业媒体Rigaku Puts Spotlight on Advanced Packaging Metrology at SEMICON Taiwan 2026
2026-08-31🇰🇷 매일경제 IT/전자반도체'반도체 벨트' 용인·이천, 소비 1조 늘었다
2026-08-31🇺🇸 EE Times专业媒体Advanced Cooling Technologies Address the Automotive Heat Challenge
2026-08-31🇺🇸 Electronics WeeklyNANDHynix looking for NAND jv fab site in Japan
2026-08-31🇰🇷 매일경제 IT/전자반도체반도체 성과급 내수 불씨 살렸다는데…테슬라가 잘 팔린 건 ‘옥의 티’
2026-08-31EE News Europe专业媒体ROHM pushes 650 V IGBT losses lower for EV auxiliary systems
2026-08-31🇰🇷 매일경제 IT/전자반도체삼전닉스, 반도체 성과급 어디에 썼나보니…한은 “동탄 집 사고 테슬라 샀다”
2026-08-31🌐 EE Times Asia专业媒体AI-Driven Memory Crunch Weighs on Global FPD Shipments
2026-08-31🌐 EE Times Asia专业媒体AMD Bets on Heterogeneous SoCs to Break GPU Dominance in Robotics
2026-08-31🌐 EE Times Asia专业媒体MIPS Expands RISC-V Role to Advance Open Architectures for Physical AI
2026-08-31🌐 EE Times Asia专业媒体Quectel Brings Android 16 to New 4G and 5G IoT Smart Modules
2026-08-31🌐 EE Times Asia专业媒体MacDermid Alpha Showcases Materials Enabling Next-gen Packaging at SEMICON Taiwan 2026
2026-08-31🌐 AsianometrysemiconductorThe Little Ceiling Robots Inside a Semiconductor Fab
2026-08-31🇺🇸 SemiWiki专业媒体CEO Interview with Phillip Stanley-Marbell of Signaloid
2026-08-31🇺🇸 SemiWiki专业媒体Five Billion Pulses Later: What DUV Optics Testing Reveals About Semiconductor Tool Uptime
2026-08-31🇺🇸 Chips and Cheese专业媒体Hot Chips 2026: Interviewing IBM's Christian Zoellin & Christian Jacobi
2026-08-30🇺🇸 Tom's HardwareDRAMChina's top DRAM maker CXMT sues Pentagon over its blacklisting — argues chips are standard civilian JEDEC spec, not defense hardware
2026-08-30🇺🇸 Chips and Cheese专业媒体Hot Chips 2026: XCENA and Samsung’s Near-Memory Compute CXL Device
2026-08-30🇺🇸 IEEE Spectrum专业媒体Noodling on Nuclear Engines
2026-08-29🇺🇸 Chips and Cheese专业媒体Hot Chips 2026: Samsung’s Processing-in-Memory (PIM)
2026-08-29🇺🇸 EE Times专业媒体Google’s Marvell Deal Shows Custom Silicon Spreading Beyond the TPU
2026-08-29🇺🇸 IEEE Spectrum专业媒体Oscar Winner Brings Monsters to Life With His Simulation Software
2026-08-29🇺🇸 Tom's HardwareDRAMMSI brings DDR4 back to gaming laptops amidst DRAM crisis — Katana 15 HX C14 available with up to Core i9-14900HX and RTX 5070
2026-08-28EE News Europe专业媒体AMD adds UCIe to Versal RF adaptive SoCs
2026-08-28EE News Europe专业媒体Pasqal completes SPAC deal with $360m for quantum expansion
2026-08-28EE News Europe专业媒体Infineon SiC boosts Fox ESS storage efficiency
2026-08-28🇺🇸 EE Times专业媒体Microscale Power Management Starts with Microflow Heat Measurement
2026-08-28🇰🇷 디일렉 반도체패키징SK하이닉스, 미 최초 첨단 패키징 인디애나 공장 2029년 양산
2026-08-28🇺🇸 EE Times专业媒体First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
2026-08-28🇺🇸 EE Times专业媒体Qualcomm Bets Open-Source AI Software Can Break Nvidia’s Lock-In
2026-08-27🇺🇸 IEEE Spectrum专业媒体Make a Portable Wide-screen Mechanical TV
2026-08-27🇺🇸 EE Times专业媒体NewPower Worldwide Expands Credit Facility to $750 Million to Support Global Growth and Customer Demand
2026-08-27🇰🇷 디일렉 반도체HBM퀄컴 "삼성·SK하이닉스 HBC에 적극적...HBM과 병행 개발"
2026-08-27EE News Europe专业媒体IBM acquires HRL Laboratories to boost quantum technologies
2026-08-27EE News Europe专业媒体AWS and NVIDIA plan 2 Million-GPU AI expansion
2026-08-27🇺🇸 EE Times专业媒体Why Connectivity Has Become an Edge AI Design Decision
2026-08-27🇺🇸 Chips and Cheese专业媒体Hot Chips 2026: Intel’s Crescent Island
2026-08-27🇺🇸 EE Times专业媒体NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
2026-08-27🇰🇷 디일렉 반도체반도체아이언디바이스, PCIM서 초소형 GaN 전력구동 반도체 전시
2026-08-27🇰🇷 디일렉 반도체반도체보스반도체, 핫 칩스서 AI 가속기 '이글-N' 소개
2026-08-27🇺🇸 IEEE Spectrum专业媒体IEEE Student Conference Provides Visibility to Budding Authors
2026-08-27🇰🇷 디일렉 반도체반도체스태츠칩팩코리아-KPCA, 반도체 패키징 산학협력 현장체험 열어
2026-08-26🇺🇸 IEEE Spectrum专业媒体A New NASA Design Turbocharges Nuclear Spacecraft
2026-08-26EE News Europe专业媒体IonQ reaches 84 Skyloom optical terminals in orbit
2026-08-26EE News Europe专业媒体Vishay power resistors push density to 650 W
2026-08-26🇰🇷 디일렉 반도체반도체LG화학, 세미콘 타이완 참가…AI 반도체 소재 공개
2026-08-26🇺🇸 Chips and Cheese专业媒体Hot Chips 2026: Fujitsu’s Monaka CPU
2026-08-26🇺🇸 Applied MaterialsDRAMDRAM Master Class: Panel-based Packaging
2026-08-25🇺🇸 IEEE Spectrum专业媒体IBM Built the Cold War’s Most Powerful Code Breaker for the NSA
2026-08-25ASML OfficialchipPerfecting chip patterns in R&D | ASML
2026-08-25🇺🇸 IEEE Spectrum专业媒体AI Companion Robots Are Closing the Human Connection in Modern Homes
2026-08-25🇺🇸 Chips and Cheese专业媒体Hot Chips 2026: Intel’s Diamond Rapids
2026-08-25🇺🇸 Chips and Cheese专业媒体SiFive’s First Server Platform
2026-08-25🇺🇸 Chips and Cheese专业媒体Hot Chips 2026: Intel’s Wildcat Lake
2026-08-25🇺🇸 IEEE Spectrum专业媒体IEEE Senior Membership Demystified
2026-08-25🇺🇸 Chips and Cheese专业媒体Hot Chips 2026: CUDA Targets RISC-V
2026-08-24🇺🇸 IEEE Spectrum专业媒体What It Takes to Be an Adaptable Engineer
2026-08-24🇺🇸 IEEE Spectrum专业媒体Building Technology People Can Trust
2026-08-24🇺🇸 Chips and Cheese专业媒体Hot Chips 2026: Applying High Bandwidth Flash (HBF)
2026-08-24🇺🇸 Chips and Cheese专业媒体Hot Chips 2026: Samsung and HBM Base Die Opportunities
2026-08-23🇺🇸 IEEE Spectrum专业媒体Poetry for Engineers: Safe Distance
2026-08-22🇺🇸 IEEE Spectrum专业媒体This IEEE Senior Member Develops AI Tools for E-Commerce Sites
2026-08-21🇺🇸 IEEE Spectrum专业媒体Stop Hunting, Start Solving: Accelerating Root Cause Analysis with Agentic AI
2026-08-21🌐 EE Times YouTubechipSilicon Grapevine Special: The Rise of Autonomous Chip Design