半导体

Semiconductor News

发布 2026年9月9日

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2026-09-06 ~ 2026-09-09 · 半导体主要资讯 56 条。点击标题前往原文。

日期来源关键词标题

2026-09-09🌐 EE Times Asia专业媒体DRAM Industry Revenue Up 60% QoQ in 2Q 2026
2026-09-09🇺🇸 SemiWiki专业媒体HBM’s Second Act: When Memory Starts Thinking
2026-09-09🇰🇷 조선비즈HBM“4개 중 3개는 불량”… 중국산 HBM 수율 부진, 원인은 TSV 기술력 미달
2026-09-09🇰🇷 디일렉 반도체칩앤시스 품은 시높시스, 칩부터 시스템까지 설계 통합
2026-09-09🇰🇷 디일렉 반도체반도체세미파이브, 4나노 반도체 첫 양산
2026-09-09🇺🇸 EE Times专业媒体Strategy Paper Urges Canada to Add Semiconductors to AI Strategy
2026-09-09🇰🇷 디일렉 반도체EUV삼성전자-ASML, D램 제조에 하이 EUV 도입
2026-09-09EE News Europe专业媒体LPWAN Decoded: Tips for choosing an IoT connectivity technology
2026-09-09EE News Europe专业媒体System Check: How do you feel about humanoid robots?
2026-09-09🇺🇸 SemiWiki专业媒体NVIDIA Vera: Rebuilding the CPU for Agentic AI
2026-09-09🇰🇷 조선비즈半導体サムスン電子がミストラルAIと半導体特化AIを共同開発投資も主導
2026-09-09🇰🇷 조선비즈반도체삼성전자, 미스트랄과 ‘반도체 특화 AI’ 공동 개발
2026-09-09🇺🇸 Tom's HardwarelithographyTSMC to start using High-NA EUV lithography in 2030 — A10 or A11 technology prime candidates for use
2026-09-08🇺🇸 EE Times专业媒体The Pragmatic Path to Achieving CRA Compliance and Securing Your Access to the EU Market
2026-09-08🌐 EE Times Asia专业媒体Memory Inflation Reshapes Wi-Fi IC Market
2026-09-08EE News Europe专业媒体Modular electronics connect in Elektor Lab Talk #50
2026-09-08🇺🇸 EE Times专业媒体The Security AI That Learns the Language of Movement
2026-09-08🇺🇸 SemiWiki专业媒体Fail-Safe Frames: Why Chips&Media’s ASIL-B Video IP Matters
2026-09-08🇺🇸 IEEE Spectrum专业媒体Rivian’s Gambit for Full Autonomy
2026-09-08🇺🇸 EE Times专业媒体Powering High Precision Lasers
2026-09-08🇺🇸 IEEE Spectrum专业媒体The Growing Proof That Autonomous Cars Save Lives
2026-09-08🇺🇸 Tom's HardwarechipVintage Emulator Studio recreates 44 legendary synths down to the chip level — free MAME-powered component-level emulation should offer exceedingly accurate sound
2026-09-08🇺🇸 Tom's HardwaresemiconductorBelgian-Chinese semiconductor researcher arrested over alleged GaN trade-secret theft — prosecutors suspect BelGaN insiders transferred chip IP to China before the company collapsed
2026-09-08EE News Europe专业媒体SEMI urges broader Chips Act 2.0 to boost Europe’s chip competitiveness
2026-09-08EE News Europe专业媒体Samsung and ASML expand High NA EUV push for next-gen DRAM
2026-09-08EE News Europe专业媒体Intel and ASML push High NA EUV toward wider production
2026-09-08🇺🇸 EE Times专业媒体How Much Impact Will AI Have on IoT Software Engineering?
2026-09-08EE News Europe专业媒体Energy Vault Advances Stoney Creek BESS
2026-09-08🇺🇸 Electronics WeeklyEUVASML and TSMC to lead transition to 12-inch photomasks for High-NA EUV
2026-09-08🇰🇷 매일경제 IT/전자반도체“6인치 넘어 12인치로”…삼성·ASML, 차세대 반도체 개발 ‘맞손’
2026-09-08EE News Europe专业媒体Arm targets agentic AI with Neoverse CSS N4
2026-09-08🇺🇸 SemiWiki专业媒体High-NA EUV Moves From Experiment to Manufacturing
2026-09-08🇺🇸 SemiWiki专业媒体ASML and TSMC’s 12-Inch Photomask Initiative: Technical Significance
2026-09-08🇺🇸 Tom's HardwareEUVIntel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combined — company also trailblazing giant 6×12 photomasks to speed production and lower costs
2026-09-08🇺🇸 Electronics WeeklyDRAMQ2 DRAM contract price up 59.5% QoQ
2026-09-08🌐 EE Times Asia专业媒体proteanTecs, MegaChips Target Deeper Silicon Visibility for Next-gen ASICs
2026-09-08🌐 EE Times Asia专业媒体Silicon Motion Advances Cybersecurity Readiness Ahead of EU Cyber Resilience Act
2026-09-08🌐 EE Times Asia专业媒体Global Chip Sales Up 6.4% in July
2026-09-08🌐 EE Times Asia专业媒体Nvidia Eyes Rebellions as Its Strategic Push into AI Inference Accelerates
2026-09-08🌐 EE Times Asia专业媒体GigaDevice Joins Zephyr Project to Expand GD32 MCU Open-Source Support
2026-09-08🇺🇸 Tom's HardwareTSMCArm debuts next-gen semi-custom Neoverse CSS N4 ‘Falcon' platform — compute subsystem packs up to 128 cores per die on TSMC N3P
2026-09-08🇺🇸 Chips and Cheese专业媒体Arm’s C2-Ultra, G2-Ultra NX, and CSS N4 IP
2026-09-08🇰🇷 디일렉 반도체반도체KPCA, 대학생과 대만 반도체 패키징 산업현장 연수
2026-09-08🇰🇷 디일렉 반도체반도체삼성전자, TSMC '光 반도체 테스트 플랫폼' 그대로 쓴다
2026-09-08🇺🇸 IEEE Spectrum专业媒体Workshops Educate African Researchers On How to Publish With IEEE
2026-09-08🇰🇷 디일렉 반도체반도체AMD, 한국 피지컬 AI 시장 정조준…반도체 장비·차량·로봇 영토 확장
2026-09-08🇺🇸 EE Times专业媒体Nvidia Acquires HuggingFace for $12.9B
2026-09-08EE News Europe专业媒体Ambient Scientific frees AI from the cloud with analogue in-memory compute architecture
2026-09-07🇺🇸 EE Times专业媒体Why Microcooling Will Be a Critical Enabler of Agentic AI
2026-09-07EE News Europe专业媒体Imec scales NbTiN superconducting circuits to 30nm
2026-09-07🇺🇸 EE Times专业媒体Why Holistic Digital Twins are Needed to Accelerate SDV Development
2026-09-07🇺🇸 EE Times专业媒体Kioxia’s Flash-for-DRAM Initiative Eyes AI Workloads
2026-09-07🌐 EE Times Asia专业媒体Silicon Motion Targets Agentic AI Storage with MonTitan SSD Reference Design Kit
2026-09-07🌐 EE Times Asia专业媒体Manz Asia and SUSS Partner to Advance Inkjet Technology for Semiconductor Packaging
2026-09-07🌐 EE Times Asia专业媒体Marelli and Microchip Advance Open Display Connectivity for Software-Defined Vehicles
2026-09-06🌐 The Chip Letter专业媒体The Innovative HP Computer Behind a Hedge Fund Pioneer