半导体

Semiconductor News

发布 2026年9月12日

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2026-09-09 ~ 2026-09-12 · 半导体主要资讯 58 条。点击标题前往原文。

日期来源关键词标题

2026-09-12🇰🇷 조선비즈반도체[인터뷰] 박준식 ST마이크로 지사장 “로봇용 반도체 포트폴리오 500여종, 1~2년 내 가격 경쟁력 갖출 것”
2026-09-12🇺🇸 EE Times专业媒体Fabships Aim to Exploit ‘Free’ Space Vacuum for Compound Semiconductor Substrates
2026-09-12🇰🇷 조선비즈HBM“HBM 공장, 잠수함까지 블록으로”… 삼성·SK도 꽂힌 ‘옥스포드 굿즈’
2026-09-12🇺🇸 EmbeddedchipletProcessors and Chiplet-Based FPGAs for Mission-Critical Systems, Scalable Physical AI Solutions: Embedded Week Insights
2026-09-12🇺🇸 IEEE Spectrum专业媒体IEEE to Reward Sections for High Voter Turnout in Annual Election
2026-09-11🇺🇸 EE Times专业媒体SoC PLANNER: A New Generation of Automated SoC Design Exploration Managing Cost-Effectiveness and Sustainability
2026-09-11🇺🇸 EE Times专业媒体Should Standards Trump Innovation?
2026-09-11🇺🇸 SemiWiki专业媒体TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of Chips
2026-09-11🇺🇸 Electronics WeeklylithographyMost Read – EnSilica in Milan, Strong IQE, EUV lithography photomasks
2026-09-11🌐 EE Times Asia专业媒体MICROIP Lands $20M Smart Residential Edge AI Project in Taiwan
2026-09-11EE News Europe专业媒体Apple Watch Series 12 Adds S11 Chip and New Health Sensors
2026-09-11🇺🇸 EE Times专业媒体Indian Researchers Look Beyond GPUs to Neuromorphic AI Hardware
2026-09-11🇰🇷 매일경제 IT/전자반도체열흘 만에 무역수지 104억달러 흑자… 반도체 수출 ‘폭등’ 165억달러
2026-09-11🇺🇸 Electronics WeeklyTSMCTSMC August revenues up 53% YoY
2026-09-11🌐 EE Times Asia专业媒体Taiyo Achieves 700-nm RDL Features on 12-inch Wafers
2026-09-11🌐 EE Times Asia专业媒体DigiKey Sponsors electronica India Tech Challenge 2026
2026-09-11🇺🇸 EmbeddedsemiconductorAlif Semiconductor Launches $49 StartKits for Edge AI MCUs
2026-09-11🇰🇷 디일렉 반도체반도체큐알티-에이아이웍스 MOU…반도체 검증에 AI 접목한다
2026-09-11🇺🇸 SemiWiki专业媒体Webinar – Avestra Explains How to Achieve Assertion Driven Silicon Success
2026-09-11EE News Europe专业媒体Envision mission shifts radar development to Europe
2026-09-11🌐 EE Times YouTubesemiconductorBesxar CEO on its First Flight to Prove Semiconductor Fab in Space
2026-09-11🇺🇸 EE Times专业媒体From AI-Assisted EDA to AI-Mediated Engineering
2026-09-11🇺🇸 IEEE Spectrum专业媒体Codeveloper of Ethernet Predecessor Dies at 91
2026-09-11🇺🇸 SemiWiki专业媒体PDF Solutions CONNECT 2026: Where Semiconductor Data Meets AI
2026-09-11🇺🇸 Tom's HardwarechipApple’s new A20 Pro smartphone chip around 25% faster than its predecessor in leaked benchmark — the 2nm CPU in the iPhone Duo and 18 Pro hits nearly 5 GHz clocks
2026-09-10🇺🇸 EmbeddedchipletChiplet-Based FPGAs Optimize Performance for Space Applications
2026-09-10EE News Europe专业媒体Renesas RZ/G3 MPUs Target HMI and IoT Edge Designs
2026-09-10🇺🇸 SemiWiki专业媒体Webinar – ChipAgents Shows You How to Break the Timing Closure Bottleneck with AI
2026-09-10🇺🇸 EE Times专业媒体Proven: Actions Technology’s End-to-End Audio Architecture Tames Sound’s “Black Magic”
2026-09-10🇺🇸 Tom's HardwaresemiconductorChinese quartz approved for semiconductor equipment and DRAM manufacturing, but it still can't break America's monopoly — China secures domestic supply for chipmaking components, but Spruce Pine still holds the crucible monopoly
2026-09-10EE News Europe专业媒体Infineon and SolarEdge bring solid-state protection to 800 VDC AI data centers
2026-09-10🇺🇸 Tom's HardwareEUVTSMC, Samsung, and Intel shore up support with ASML to deploy larger High-NA EUV photomasks — 6×12-inch photomask transition may take years despite unified effort
2026-09-10🇺🇸 EE Times专业媒体ADI Snaps Alif Semiconductor to Push AI into Physical Systems
2026-09-10🇺🇸 Chips and Cheese专业媒体On Binary Translation and its Consequences
2026-09-10EE News Europe专业媒体Renesas launches 64-bit RZ/G3L, RZ/G3SE MPUs for HMI and IoT edge
2026-09-10🇺🇸 EE Times专业媒体What Six Hours on the Runway Told Me About Air Traffic Control, Resilience, and AI
2026-09-10🇺🇸 EE Times专业媒体Cincon High-Performance Power Modules for Edge AI & IPCs
2026-09-10🌐 EE Times Asia专业媒体SK keyfoundry, Elmos Expand Partnership with 130nm Wafer Supply Deal
2026-09-10🌐 EE Times Asia专业媒体Silicon Motion Now Certified to ISO/SAE 21434 Standards
2026-09-10🌐 EE Times Asia专业媒体Analog Devices Strengthening Edge AI Capabilities by Acquiring Alif Semiconductor
2026-09-10🌐 EE Times Asia专业媒体Synopsys, A*STAR IME Target Simulation-led Advanced Packaging Development
2026-09-10🇰🇷 IT World Korea칩아이폰 18 프로, 가변 조리개·2나노 칩·다이나믹 아일랜드 2.0으로 완성한 프로 경험
2026-09-10🇺🇸 SemiWiki专业媒体Jalapeño Hot Chip, Cool Power Bill: OpenAI Turns Up the Heat on AI Inference
2026-09-10🇺🇸 EE Times专业媒体LEDs Push Wireless Power Further
2026-09-10EE News Europe专业媒体Chips Act 2.0, Part 4: Who benefits and who misses out?
2026-09-10EE News Europe专业媒体OpenAI Samsung collaboration extends to next-generation chips
2026-09-10🇺🇸 Tom's HardwarechipApple A20 Pro powers iPhone Duo, 18 Pro — the company's first 2-nanometer smartphone chip
2026-09-10🇰🇷 디일렉 반도체파운드리SK키파운드리, 엘모스에 11년간 130나노 파운드리 공급
2026-09-10🇰🇷 디일렉 반도체파운드리DB하이텍, 8인치 SiC 파운드리 양산 눈앞
2026-09-10🇺🇸 IEEE Spectrum专业媒体An Engineer’s Guide to Surviving a Layoff
2026-09-09🇺🇸 Tom's HardwareTSMCOpenAI says its next-generation processors could be made at Samsung — double-sourcing with TSMC hints at massive volume requirements [Updated]
2026-09-09EE News Europe专业媒体Sensata webinar targets data centre power and cooling
2026-09-09EE News Europe专业媒体Infineon OPTIREG PMIC integrates power and safety for EV traction inverters
2026-09-09EE News Europe专业媒体Quantinuum lands $100m CHIPS award for trapped-ion quantum manufacturing
2026-09-09🇰🇷 디일렉 반도체반도체삼성전자-미스트랄 AI, 반도체 설계·제조 특화 AI 만든다
2026-09-09🌐 EE Times Asia专业媒体IC Optimize Launches Odin Analog Optimization Tool, Joins Cadence Connections Program
2026-09-09🌐 EE Times Asia专业媒体EdgeCortix, Kawasaki Team Up on AI Computing for Future Aerial Defense Systems
2026-09-09🌐 EE Times Asia专业媒体SEEQC Taps Taiwan’s Semiconductor Ecosystem to Expand Quantum Computing Supply Chain