半导体

Semiconductor News

发布 2026年9月18日

将以当前语言复制一段把此列表按国家·公司·技术汇总的提示词。粘贴到 Claude·ChatGPT 等任意 AI 即可。

2026-09-15 ~ 2026-09-18 · 半导体主要资讯 47 条。点击标题前往原文。

日期来源关键词标题

2026-09-18🇺🇸 EE Times专业媒体U.S. Awards Anderon $1B for Quantum Wafer Manufacturing
2026-09-18🇰🇷 조선비즈半導体KOSPIとサムスン電子・SKハイニックスの連動強まる半導体が指数主導
2026-09-18🇰🇷 조선비즈반도체반도체 독주 끝나나 했더니… 코스피와 삼전·하닉 동조화 ‘역대급’
2026-09-18🇰🇷 조선비즈반도체‘반도체 백혈병 기금’ 삼성 500억으로 산재 막겠다더니… 8년째 문 못 연 안전보건센터
2026-09-18🇺🇸 EE Times专业媒体Electronics Design Analysis for PCBs, Packages and Devices
2026-09-18🌐 EE Times YouTubechipWhere Chip Design Meets Physics: A Conversation with Synopsys' John Lee
2026-09-18🇺🇸 SemiWiki专业媒体The Invisible Bottleneck Is Costing You Time You Can’t Get Back
2026-09-17🇺🇸 EE Times专业媒体Sourcing COTS Capacitors for New Space Applications
2026-09-17🇰🇷 디일렉 반도체반도체쎄미하우, 소부장 으뜸기업 선정…글로벌 전력반도체 시장 공략 확대
2026-09-17🇺🇸 SemiWiki专业媒体ASML Has High-NA and Chipmakers Can’t Say No
2026-09-17🇺🇸 EE Times专业媒体SK Hynix’s Intel Liaisons: What You Need to Know
2026-09-17🌐 EE Times Asia专业媒体Global Edge AI Ecosystem Converges in Taipei for EDGE AI Taipei 2026 This October
2026-09-17🇺🇸 EE Times专业媒体No Summer Lull for Semiconductors
2026-09-17🌐 EE Times Asia专业媒体Infineon to Sell NOR Flash, F-RAM Business to Winbond for $1.12B
2026-09-17🌐 EE Times Asia专业媒体Centralized Compute and Standardized Interfaces Reshape Humanoid Robot Architectures
2026-09-17🌐 EE Times Asia专业媒体SiFive, AMD Demonstrate ROCm AI Workloads on RISC-V Datacenter Platform
2026-09-17🌐 EE Times Asia专业媒体ADI Adopts Cadence Tensilica Architecture for Next-gen Automotive DSPs
2026-09-17🌐 EE Times Asia专业媒体Nordic Expands nRF93M1 Smart Modem for Global Cat 1 bis IoT Deployments
2026-09-17🌐 EE Times Asia专业媒体Global Foldable Shipments to Hit 100-million Mark by End-2026
2026-09-17🇺🇸 EDN NetworkchipSPAD sensor processes photon events on-chip
2026-09-17🇺🇸 EE Times专业媒体Smarter Cameras Need More Than Edge AI to Protect Privacy
2026-09-17🇺🇸 IEEE Spectrum专业媒体Rethinking Robot Safety in the Age of AI
2026-09-17EE News Europe专业媒体US data centre gas demand to exceed most countries by 2035
2026-09-17🇺🇸 EE Times专业媒体RAMXEED ULTIMATE FeRAM Guarantees 10-Year Data Retention under Continuous 125°C Exposure
2026-09-17🇺🇸 EE Times专业媒体Edge-first Architectures for Building and Campus Safety and Security
2026-09-17🇺🇸 SemiWiki专业媒体Arm targets the agentic AI era with new edge, cloud and robotics platforms
2026-09-16🇺🇸 EE Times专业媒体Z-Wave Long Range Extends IoT Reach Beyond Mesh Networks
2026-09-16🇺🇸 Tom's HardwareHBMPiecemakers bets edge AI devices will diverge from reliance on HBM — custom-designed memory fuses DRAM stack directly to the processor using hybrid bonding
2026-09-16🇺🇸 IEEE Spectrum专业媒体Single-Phase Direct Liquid Cooling Is Proven for the Next Decade of Ultra-Dense Compute
2026-09-16🇺🇸 SemiWiki专业媒体Rethinking AI Chips: How VSORA Redesigned the Hardware That Runs AI
2026-09-16🇺🇸 Tom's HardwarelithographyJensen Huang thinks China will develop its own advanced lithography chipmaking tools by 2030 — Nvidia CEO says achievement of that capability 'is just a matter of time'
2026-09-16🇺🇸 Tom's HardwarechipSK hynix reportedly discussing US memory chip manufacturing with Intel — options include leasing Ohio plant or forming joint venture with other AI hyperscalers
2026-09-16EE News Europe专业媒体Tektronix unveils regenerative test system for 800V AI data center power
2026-09-16🌐 EE Times Asia专业媒体Arrow Electronics Enables Early Evaluation of NXP’s Ara240 Edge AI Accelerator
2026-09-16EE News Europe专业媒体Cisco expands Splunk AI with NVIDIA
2026-09-16🇺🇸 Tom's HardwarechipOriginal Sony PlayStation 2 security chip ‘broken wide open’ after 26 years — chemical decapping and four years of reverse engineering unlocks MechaCon secrets
2026-09-16EE News Europe专业媒体F-Secure and AMD route AI workloads for safer agentic computing
2026-09-16🇺🇸 EE Times专业媒体Pasqal’s Nasdaq Debut Meets a Risk Reckoning
2026-09-16🌐 EE Times Asia专业媒体TrendForce: AI Demand Drives Sharp Split in NOR Flash Pricing
2026-09-16🌐 EE Times Asia专业媒体JETRO, Purdue University Expand Japan-U.S. Advanced Technology Collaboration
2026-09-16EE News Europe专业媒体System Check: Should designers move fast and break things?
2026-09-16🇺🇸 SemiWiki专业媒体A Study of Photoresist Bake Influence on Stochastics for DUV Immersion Lithography
2026-09-16🇺🇸 EmbeddedchipMediaTek Unveils New Flagship Smartphone Chip
2026-09-15🇺🇸 IEEE Spectrum专业媒体The AI Inference Revolution Is Here
2026-09-15🇺🇸 IEEE Spectrum专业媒体The Mind-bending Joyrides That Gave Rise to Tesla
2026-09-15EE News Europe专业媒体LPWAN Decoded: Tips for choosing an IoT connectivity technology
2026-09-15EE News Europe专业媒体NVIDIA extends CUDA-Q for fault-tolerant quantum systems