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Semiconductor News

Published July 26, 2026

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2026-07-23 ~ 2026-07-25 · 43 top Semiconductor stories. Click a title to open the source.

DateSourceKeywordTitle

2026-07-25🇺🇸 IEEE SpectrumTrade pressPoetry for Engineers: A Martian Rover Sends a Postcard Home
2026-07-25🌐 AsianometryHBMHybrid Memory Cube: HBM's Challenger #short #history #tech
2026-07-25🇺🇸 EE TimesTrade pressIntel Foundry Improves Execution, but External Customers Remain the Test
2026-07-25🇺🇸 IEEE SpectrumTrade press2022 IEEE President K.J. Ray Liu Honored for His Leadership
2026-07-25🇺🇸 SemiWikiTrade pressTSMC CoPoS Versus Intel EMIB Semiconductor Packaging
2026-07-25🇺🇸 EE TimesTrade pressDAC 2026: What Does It Actually Take to Create AI Chips?
2026-07-25🇺🇸 Tom's HardwarechipAMD working on new X3D V-cache mobile chip for gaming laptops, leaker claims — Ryzen 7 9800HX3D could launch with 8 cores, 16 threads, and 96MB cache
2026-07-24🇺🇸 SemiWikiTrade pressThe Silicon Shield Has Never Been Stronger!
2026-07-24EE News EuropeTrade pressElektor Lab Talk #49 examines USB-C and mobile power
2026-07-24EE News EuropeTrade pressconga-HPC/cRX1 module brings Ryzen AI X100 to the edge
2026-07-24🌐 EE Times AsiaTrade pressSamsung Unveils Flex Titanium Technology for Thinner, More Durable Foldable Displays
2026-07-24EE News EuropeTrade pressNVIDIA backs Amkor with $1.5bn to expand AI packaging in the US
2026-07-24EE News EuropeTrade pressPsiQuantum lands $125m DARPA quantum deal
2026-07-24🌐 EE Times AsiaTrade pressSupporting Vietnam’s Server and Networking Supply Chain: T-Global Technology to Host Thermal Management Innovation Seminar in Hanoi
2026-07-24🌐 EE Times YouTubechipWhat It Takes To Build An AI Chip Startup In Europe
2026-07-24🌐 EE Times AsiaTrade pressST Posts 26% Revenue Growth in Q2 as AI Datacenter Demand Boosts Outlook
2026-07-24🌐 EE Times AsiaTrade pressIntel, Fortinet Partner to Develop Next-generation Security Processor
2026-07-24🇰🇷 매일경제 IT/전자반도체반도체값이 만든 ‘소득 13.2% 급증’…일자리 줄었는데 금리 올린 한은 [BOK WATCHER]
2026-07-24EE News EuropeTrade pressThe Ton Giesberts Collection: Practical Analog and Audio Projects
2026-07-24🇺🇸 EE TimesTrade pressSupply Chain Leaders’ New Math for Network Decisions
2026-07-24EE News EuropeTrade pressShaping the Future of IoT: The Things Conference 2026 in Amsterdam
2026-07-24🇺🇸 Electronics WeeklypackagingAdvanced packaging market to hit $120bn by 2031
2026-07-24🇰🇷 매일경제 IT/전자반도체“삼성전자급 기업 나올 수 있어”…K바이오, 10년 후엔 반도체 넘어선다
2026-07-24🇺🇸 SemiWikiTrade pressPCs & Smartphones Supply Constrained
2026-07-24🇺🇸 EE TimesTrade pressU.S. Starts Genesis Mission with $5B for First Projects
2026-07-24🇺🇸 SemiWikiTrade pressAgentrys Designs a Real Chip with its Multi-Agent Workforce
2026-07-24🇺🇸 EE TimesTrade pressThe Story Behind Fuse EDA AI system
2026-07-24🇺🇸 Tom's HardwarechipAMD’s new X100 chip lineup puts embedded Ryzen AI 'Strix Halo' chips into robots – APUs for physical AI bring Zen 5 CPU, RDNA 3.5 GPU cores to compete with Intel’s Panther Lake
2026-07-24🇺🇸 Tom's HardwarewaferAMD and Cerebras partner on low-latency, high-throughput AI inference — EPYC processors in Helios rack-scale infrastructure paired with Cerebras' Wafer-Scale Engine (WSE) solutions
2026-07-24🇺🇸 Chips and CheeseTrade pressAMD’s Instinct MI455X: Aiming for the Sun
2026-07-24🇺🇸 Tom's HardwaresemiconductorNew semiconductor firm breaks cover, backed by $43 million in early-stage funding — TYLsemi aims to deliver custom silicon to customers without breaking the bank
2026-07-24🇺🇸 SemiWikiTrade pressMust-See DAC Panel – Build vs Buy: Who Owns the Intelligence Behind Tomorrow’s Chips?
2026-07-24🇺🇸 EE TimesTrade pressEtched Raises $300M with $1B in Pre-Orders
2026-07-23EE News EuropeTrade pressCyber Resilience Act, Part 1: The first deadlines are approaching
2026-07-23EE News EuropeTrade pressWebinar: From Supplier Request to ECO in Minutes
2026-07-23EE News EuropeTrade pressAMD and Anthropic partner on 2GW AI GPU deployment
2026-07-23EE News EuropeTrade pressSTMicroelectronics reports Q2 revenue growth
2026-07-23🇺🇸 EE TimesTrade pressDAC 2026: Users Are Not Waiting; DIY AI Is Now in Vogue
2026-07-23🌐 EE Times AsiaTrade pressSamsung Continues to Lead Global Foldable Smartphone Market
2026-07-23🌐 EE Times AsiaTrade pressMicro-transfer Printing Advances Heterogeneous Integration for Next-gen Silicon Photonics
2026-07-23🌐 EE Times AsiaTrade pressGaN Moves to Center of AI Data Center Power Architectures
2026-07-23🌐 EE Times AsiaTrade pressPhilippines’ ASEAN Chairship Elevates PSECE 2026 with Stronger Regional Semiconductor Collaboration
2026-07-23🇺🇸 EE TimesTrade pressFrom Rhetoric to Metrics: Raghib Hussain’s First Year as Altera CEO